Technical Data

Dimensions

Standard model (BVS CA-SF1)

Figure 1: BVS CA-SF1-xxxxxx-x6xx2x dimensions and connectors

BVS CA-SF1-xxxxxx-x6xx2x
Size of body (w x h x l)	39 x 39 x 24 mm

Lens protrusion	C-Mount	CS-Mount
	12.5 mm	7.5 mm

Mounting holes

On the bottom-side, the BVS CA-SF1 provides integrated tripod mounting holes.

Figure 2: BVS CA-SF1 mounting holes

Figure 3: Dimensional drawing of tripod adapter

Standard model (BVS CA-SF2)

Option -11xxx (lensholder without back focus adjustment)

Figure 4: BVS CA-SF2-xxxxxx-11xxxx dimensions and connectors

BVS CA-SF2-xxxxxx-11xxxx
Size of body (w x h x l)	40 x 40 x 50.9 mm

Lens protrusion
	10.7 mm with 1" lenses

Mounting holes

The BVS CA-SF2-xxxxxx-12xxxx provides integrated mounting holes.

Figure 5: BVS CA-SF2-xxxxxx-11xxxx mounting holes

Option -12xxx (lensholder with back focus adjustment)

Figure 6: BVS CA-SF2-xxxxxx-12xxxx dimensions and connectors

BVS CA-SF2-xxxxxx-12xxxx
Size of body (w x h x l)	39.8 x 39.8 x 37.7 mm

Lens protrusion	C-Mount	CS-Mount
X	8 mm	6 mm

	C-Mount	CS-Mount
W	approx. 15 mm (C-mount)	approx. 10 mm (CS-mount)
Z	17.526 mm (in air)	12.5 mm (in air)

Mounting holes

The BVS CA-SF2-xxxxxx-12xxxx provides integrated mounting holes.

Figure 7: BVS CA-SF2-xxxxxx-12xxxx mounting holes

Model without housing (BVS CA-SF1-xxxxxx-x00000)

Attention

"Broken connectors"

Handle the connectors with care otherwise you can damage the device.

→ In combination with the connectors, please limit the mechanical stress.

Figure 8: BVS CA-SF1-xxxxxx-x00000 dimensions and connectors

Figure 9: BVS CA-SF1-xxxxxx-xY0000 with S-Mount lensholder BF3-LH-SMNT 13

I/O board mvBlueFOX3-IO

Figure 10: Dimensions of additional I/O board mvBlueFOX3-IO

The following figure shows, how the additional I/O board mvBlueFOX3-IO gets connected correctly.

Attention

"Short circuit"

Since the connector of the I/O board will also fit upside down, you have to be careful while connecting. Otherwise you can destroy the camera and / or the I/O board.

→ As show in the figure, if the I/O board was connected correctly, you can bend the I/O board on the back of the sensor board. Then the I/O board connector will point to the opposite direction as the sensor.

Figure 11: BVS CA-SF1-xxxxxx-x00000 connected I/O board

The pinning of the mvBlueFOX3-IO is described in the chapter Circular connector male (Power / Digital I/O).

Note

There is also a version of the I/O board without connector as "mvBlueFOX3-IO NC" (NC = not connected). The pinning is provided in the figure:

Figure 12: Dimensions of additional I/O board mvBlueFOX3-IO without connector

Model without housing (BVS CA-SF2-xxxxxx-xxx0xx)

Attention

"Broken connectors"

Handle the connectors with care otherwise you can damage the device.

→ In combination with the connectors, please limit the mechanical stress.

Figure 13: BVS CA-SF2-xxxxxx-x0x02x dimensions and connectors

S-mount lensholder and heat sink backplate option (BVS CA-SF2-xxxxxx-xYx5xx)

The heat sink backplate is connected to the GND potential of the camera's power. The connection itself takes place via the fixing points. Both, the mounting holes on the lensholder (4x M2) as well as the mounting holes at the heat sink plate (2x M3) can be used to mount the camera.

Figure 14: BVS CA-SF2-xxxxxx-xYx5xx dimensions and connectors

Attention

"Overheating"

Wihtout a heat sink the device can be damaged.

→ Pay attention to the Overheating and Cooling .

C-mount lensholder and heat sink backplate option (BVS CA-SF2-xxxxxx-x1x51x)

The heat sink backplate is connected to the GND potential of the camera's power. The connection itself takes place via the fixing points. Both, the mounting holes on the lensholder (12x M4) as well as the mounting holes at the heat sink plate (2x M3) can be used to mount the camera.

Figure 15: BVS CA-SF2-xxxxxx-x1x51x dimensions and connectors

Attention

"Overheating"

Wihtout a heat sink the device can be damaged.

→ Pay attention to the Overheating and Cooling .

Lens protrusion
X	10.7 mm with 1" lenses

	C-Mount	CS-Mount
Z	17.526 mm (in air)	12.5 mm (in air)

Fixed and compact C-mount lensholder (BVS CA-SF2-xxxxxx-x7x01x)

Figure 16: BVS CA-SF2-xxxxxx-x7x01x dimensions and connectors

Lens protrusion
X	13.1 +- 0.5

	C-Mount
Z	17.526 mm (in air)

Single-board Model for Embedded Vision (BVS CA-SF3)

Figure 17: BVS CA-SF3-xxxxxx-1xxx2x dimensions and connectors

See also

BFembedded interface (BVS CA-SF3,BVS CA-SF5)

Hi-res model (BVS CA-SF4)

Figure 18: BVS CA-SF4-xxxxxx-xNxx2x dimensions and connectors

BVS CA-SF4-xxxxxx-xNxx2x
Size of body (w x h x l)	49.8 x 49.8 x 54.215 mm

Mounting holes

The BVS CA-SF4 provides integrated mounting holes.

Figure 19: BVS CA-SF4 mounting holes

Board-level Model for Embedded Vision (BVS CA-SF5)

Figure 20: BVS CA-SF5-xxxxxx-1xxx2x dimensions and connectors

Note

The red dot marks pin 1.

See also

BFembedded interface (BVS CA-SF3,BVS CA-SF5)

Camera interfaces (BVS CA-SF)

Circular connector male (Power / Digital I/O)

Figure 21: 12-pin (male; top view), digital I/O, power

Pin.	BVS CA-SF1 (Signal)	BVS CA-SF2 / BVS CA-SF4 (Signal)	Line in ImpactControlCenter	Cable KS-BCX-HR12 color scheme
1	GND (for PWR_IN)			black
2	not connected, leave open	PWR_IN		brown
3	Opto DigOut3		Line3	red
4	Opto DigIn0		Line4	orange
5	Opto DigOut2		Line2	yellow
6	Opto DigOut0		Line0	green
7	Opto DigIn_GND			blue
8	RS232 RX			violet
9	RS232 TX			gray
10	Opto DigOut_PWR_IN			white
11	Opto DigIn1		Line5	white-black
12	Opto DigOut1		Line1	white-brown
	Main connector shield		Main connector shield	Main shield

Connector (camera side): SAMWOO SNH-10-12 (RPCB) or equivalent
Plug (matching cable plug): Hirose HR10A-10P-12S (01) or equivalent

Pinning of KS-BCX-HR12

Pin.	CON 1 BVS CA-SF1 | Signal	CON 1 BVS CA-SF2 / BVS CA-SF4 | Signal	CON 2 open ended cable | Color
1	GND (for PWR_IN)		black
2	not connected	PWR_IN	brown
3	DigOut3 (ImpactControlCenter numbering: line3)		red
4	Opto DigIn0 (line4)		orange
5	DigOut2 (line2)		yellow
6	DigOut0 (line0)		green
7	Opto DigIn GND		blue
8	RS232_RX		violet
9	RS232_TX		gray
10	Opto DigOut_PWR_IN		white
11	Opto DigIn1 (line5)		white-black
12	Opto DigOut1 (line1)		white-brown
	Main connector shield		main shield

Color assignment following international code for UL wiring.

Power Supply

The devcies are bus powered. Anyway, it is possible to power the BVS CA-SF2 externally with following specs:

• Input voltage range:
  • 12 .. 24 V DC (typical)
  • min. 10V
  • max. 28V
• The power supply is protected against
  • burst (EN 61000-4-4)
  • surge (EN 61000-4-5) and
  • polarity inversion
• internal short circuit protection by 1.5 A slow blow fuse

The USB power cannot be accessed via the I/O connector (this is prevented by a diode).

Note

The BVS CA-SF2 will reboot whenever you connect or disconnect the power at pin 2.

Attention

For BVS CA-SF4 an external power supply is obligatory (USB power supply may exceed 900 mA).

Characteristics of the digital inputs

Electrical characteristics

Delay

Figure 22: Input switching times

	Standard
Notes
High level	+3 to +24 V (max. 30 V)
Low level	0 V (min. -30 V) to +0.7 V
Threshold (Low --> High / High --> Low)	2 V +- 1 V
Imax	5 mA
	Figure 23: Opto DigIn mvBlueFOX3-1/-2/-M2/-4

Switching characteristics

Characteristics	Symbol	Test conditions	Typ.	Unit
Minimum trigger pulse width			5	us
Turn-On time	tON	R = 2 kOhm (Figure 7), internal output voltage 5 V, IF = 16 mA	10
Storage time	tS		25
Turn-Off time	tOFF		40

Characteristics of the digital outputs

Electrical characteristics

	Comment	Min.	Typ.	Max.	Unit
IC	load current			15	mA
VCE(sat)	@ IC = 7 mA		0.4		V
VOUT	Output Voltage			30	V
	Figure 24: Opto DigOut BVS CA-SF1/BVS CA-SF2/BVS CA-SF4

Switching characteristics

Characteristics	Symbol	Test conditions	Typ.	Unit
Turn-On time	tON	RL = 100 Ohm, VCC 10 V, IC = 2 mA	3	us
Storage time	tS		3
Turn-Off time	tOFF		3
Turn-On time	tON	RL = 1.9 kOhm, VCC 5 V, IC = 16 mA	10	us
Storage time	tS		25
Turn-Off time	tOFF		40

Figure 25: Switching time

Status / Power LED

Standard model (BVS CA-SF1)

State	LED color
No power, no USB connection or DeviceIndicatorMode is set to Inactive.	Off
No Bootloader found, Bootloader was recognized and FPGA is booting-up or device is in standby mode.	Red
mvBlueFOX3 is running.	Green
mvBlueFOX3 is busy (e.g. file upload).	Green blink

Standard model (BVS CA-SF2)

State	LED color
No power or DeviceIndicatorMode is set to Inactive.	Off
Bootloader was recognized and FPGA is booting-up.	White
mvBlueFOX3 is running.	Yellow
mvBlueFOX3 is streaming images.	Green
mvBlueFOX3 is busy (e.g. file upload).	Yellow blink
Waiting for USB connection with loaded FPGA (external power is connected).	White blink
Waiting for first USB connection, internal Error detected or device is put into standby.	Red
For HW Revision 2.01: Device is put into standby.	Turquoise

BFembedded interface (BVS CA-SF3,BVS CA-SF5)

The BFembedded interface provides USB3.2 Gen.1 - SuperSpeed (5Gbps) including USB2.0 - Hi-Speed (480Mbps) and various IO functionality on a single 48-pin Board-to-Board connector. The main features of the user I/O interface are

• 4 digital inputs,
• 4 digital outputs,
• a UART interface for serial communication, and
• a I2C two wire serial interface.

Attention

"Disconnections"

When using BVS CA-SF3 or BVS CA-SF5 with the rigid-flex extension cable (BFE-FLEX), please ensure you have connected it correctly.

"Camera connector"

• Hirose DF40GB-48DP-0.4V

"Mating Connector"

Used for accessory IO Boards or customer implementation.

• Hirose DF40GB(3.0)-48DS-0.4V

"Mechanical characteristics"

• 48-pin, 0.4 mm pitch, shielded, stacking height: 3.0 mm
• 2 steel spacers (height 3mm). Thread M1.6, max. screw depth 1.8 mm.

Pin assignment

Figure 26: BFembedded interface - pin 1

Note

The red dot marks pin 1 of Hirose DF40GB-48DP-0.4V.

Pin	Signal	Description
1	VBUS_5V	USB Power
2	VBUS_5V	USB Power
3	VBUS_5V	USB Power
4	POWER_DOWN_N	- Complete power shut down Pull to GND for power down Internal 10K pull up to VBUS_5V
5	VBUS_5V	USB Power
6	VAUX_PRESENT_N	- External power supply indication Connect to VBUS if USB supplied Otherwise leave open
7	D-	USB 2.0 Data - (differential)
8	-	Do not connect, internal use
9	D+	USB 2.0 Data + (differential)
10	-	Do not connect, internal use
11	ID	OTG-Identification (OTG = On-The-Go)
12	-	Do not connect, internal use
13	GND	Ground
14	-	Do not connect, internal use
15	GND	Ground
16	GND	Ground
17	GND	Ground
18	GND	Ground
19	SSTX-	USB3 Super Speed Transmitter (differential), polarity inversion allowed
20	-	Do not connect, internal use
21	SSTX+	USB3 Super Speed Transmitter (differential), polarity inversion allowed
22	-	Do not connect, internal use
23	GND	Ground
24	-	Do not connect, internal use
25	SSRX+	USB3 Super Speed Receiver (differential), polarity inversion allowed
26	-	Do not connect, internal use
27	SSRX-	USB3 Super Speed Receiver (differential), polarity inversion allowed
28	-	Do not connect, internal use
29	GND	Ground
30	-	Do not connect, internal use
31	GND	Ground
32	GND	Ground
33	GND	Ground
34	GND	Ground
35	DigOut0	Digital Output (with level shifter), voltage reference VCC_IO
36	VCC_IO	I/O voltage reference input 1.8 V...5.0 V, abs. min max: 1.65 V...5.5 V Note Leave not unconnected! Connect to VBUS_5V if I/O not used.
37	DigOut1	Digital Output (with level shifter), voltage reference VCC_IO
38	DigIn2	Digital Input (with level shifter), voltage reference VCC_IO
39	DigOut2	Digital Output (with level shifter), voltage reference VCC_IO
40	DigIn3	Digital Input (with level shifter), voltage reference VCC_IO
41	DigOut3	Digital Output (with level shifter), voltage reference VCC_IO
42	UART_RX	Serial interface (see details below), LVCMOS 3.3 V IO level
43	DigIn0	Digital Input (with level shifter), voltage reference VCC_IO
44	UART_TX	Serial interface (see details below), LVCMOS 3.3 V IO level
45	DigIn1	Digital Input (with level shifter), voltage reference VCC_IO
46	I2C_SCL	I2C two wire serial bus (see details below), LVCMOS 3.3 V IO level
47	-	Do not connect, internal use
48	I2C_SDA	I2C two wire serial bus (see details below), LVCMOS 3.3 V IO level

Note

Additional shield pins are connected to GND.

Electrical characteristics of signals

USB Power

Signal	Parameter	min	nom	max	Unit
VBUS_5V		4.45	5	5.25	V
IVBUS_5V*				900	mA
I per pin				300	mA

^*Limit for USB3 high-power SuperSpeed devices (Power consumption of the camera will be within this limit).

The rated current limit for the connector is 300 mA per pin and therefore the BF3-Embedded Interface would allow up to 1200 mA.

VCC_IO / DIGIN / DIGOUT

Signal	Parameter	min	nom	max	Unit
VCC_IO	I/O voltage power	1.65		5.5	V
UDIG_IN_LOW	VIL (low level input voltage)			VCC_IO x 0.3	V
UDIG_IN_HIGH	VIH (high level input voltage)	VCC_IO x 0.7			V
IOH	High-level output current VCC_IO: 4.5 V to 5.5 V			-32	mA
IOL	Low-level output current VCC_IO: 4.5 V to 5.5 V			32	mA
UDIG_OUT_HIGH	Digital output (VCC_IO = 4.5 V / IOUT= -32 mA)	3.8			V
UDIG_OUT_LOW	Digital output (VCC_IO = 4.5 V / IOUT= 32 mA)			0.55	V

Digital I/Os include level shifters to allow customized IO Levels for both inputs and outputs. VCC_IO (Pin 36) is the input for the user defined IO voltage.

Note

If no I/O functionality is needed, connect VCC_IO to VBUS_5V.

For other output characteristics, see datasheet SN74LVC2T45.

Serial Interface, I2C and Power Down

Signal	Parameters / Properties	min	nom	max	Unit
POWER_DOWN_N	Complete power shut down, internal 10K pull up to VBUS_5V
	POWER_DOWN_N Input Low Voltage	0		0.75	V
	POWER_DOWN_N Input High Voltage	1.8		5	V
UART_RX / UART_TX	Voltage level The camera provides a UART Interface for serial communication (internally protected by 100 Ohm series resistor)		3.3	3.4	V
I2C_SCL / I2C_SDA	Voltage level, internal 2K pull up to 3.3 V Camera provides a I2C master to control devices connected to the bus Interface clock rate 400 kHz Reserved I2C addresses (8 Bit) of shared devices: 0x0, 0x30...0x36, 0x48, 0x60...0x66, 0xA0...0xA6, 0xB0...0xBE, 0xF8 Access to the I2C interface has to be enabled By default the access to the I2C bus is disabled to prevent unintended interference		3.3	3.4	V

Boards for the BFembedded interface (BVS CA-SF3,BVS CA-SF5)

USB Micro B (horizontal)

The board includes a USB3 Micro B connector (CON3) in horizontal alignment, a 12-pin header (CON2) for IO signals and a 3-pin header (CON4) for I2C, weight 2g.

"Order Code": BFE-IF-MICUSB3B-H-IO12

Figure 27: Connectors of the USB3 Micro B board (horizontal)

USB Micro B (vertical)

The board includes a USB3 Micro B connector (CON3) in vertical alignment, a 12-pin header (CON2) for IO signals and a 3-pin header (CON4) for I2C, weight 2g.

"Order Code": BFE-IF-MICUSB3B-V-IO12

Figure 28: Connectors of the USB3 Micro B board (vertical)

USB Type C

The board includes a USB Type C connector (CON3) in horizontal alignment, a 12-pin header (CON2) for IO signals and a 3-pin header (CON4) for I2C, weight 2g.

"Order Code": BFE-IF-USB3C-H-IO12

Figure 29: Connectors of the USB Type C board

Pin assignments

12-pin I/O connector (CON2)

• Part type:
  • Wire-to-Bord Connector 1.25 mm, WUERTH_653012114822 or MOLEX PicoBlade 53047_1210
• Connecting part:
  • Würth: 653 012 113 322 1.25 MM female terminal housing with female crimp terminal WR-WTB 653 001 137 22 or
  • Molex 0510211200, 1.25 Wire to Board Connection Receptacle Housing, Applicable Terminal 50058-8000, 50079-8000 Series

Pin	I/O	Signal	Description
1	Out	DigOut0	Digital Output
2	Out	DigOut1	Digital Output
3	Out	DigOut2	Digital Output
4	Out	DigOut3	Digital Output
5	In	DigIn0	Digital Input
6	In	DigIn1	Digital Input
7	In	DigIn2	Digital Input
8	In	DigIn3	Digital Input
9	Out	RS232_TXD	Serial Interface RS232_TXD
10	In	RS232_RXD	Serial Interface RS232_RXD
11	GND	GND	Ground
12	POWER_OUT	VBUS_OUT	Directly connected to USB Power

"Electrical characteristics of signals"

"VBUS_OUT / DIGIN / DIGOUT"

Signal	Parameter	min	nom	max	Unit
VBUS_OUT		4.45	5.00	5.25	V
IVBUS_OUT				10	mA
UDIG_IN_LOW	VIL (low level inputvoltage)			0.3	V
UDIG_IN_HIGH	VIH (high level inputvoltage)	0.7		5.5	V
IOH	High-level output current			-32	mA
IOL	Low-level output current			32	mA
UDIG_OUT_HIGH	Digital output (IOUT= -32 mA)	3.8			V
UDIG_OUT_LOW	Digital output (IOUT= 32 mA)			0.45	V

"Serial interface RS232"

Signal	Test Properties	min	nom	max	Unit
EIA/TIA-232E Input Voltage Range*		-30		+30	V
EIA/TIA-232E Input Threshold Low		0.6	1.3		V
EIA/TIA-232E Input Threshold High			1.6	2.4	V
EIA/TIA-232E Input Hysteresis			0.4		mA
EIA/TIA-232E Input Resistance		3	5	7	V
Output Voltage Swing		±5.0	±5.7		V
RS-232 Output Short-Circuit Current			±15		mA
ESD PROTECTION	Human body model air discharge Human body model contact discharge		±15 ±8		kV kV
TIMING CHARACTERISTICS Maximum Data Rate		460			kbps

^* Guaranteed by design.

USB Micro B Connector (CON3)

• Standard USB3.0 Micro-B Connector
• Part Type: WUERTH_ 692 622 030 100

Pin	I/O	Signal	Description
1	Power_IN	VBUS_IN	Digital Output
2	In/Out	D-	USB 2.0 Data −(differential)
3	In/Out	D+	USB 2.0 Data +(differential)
4	IN	ID	OTG-Identification (OTG= On-The-Go)
5	GND	GND	Ground to Pin 1
6	In/Out	SSTX-	Super Speed Transmitter(differential)
7	In/Out	SSTX+	Super Speed Transmitter(differential)
8	GND	GND	Ground for Super SpeedSignale
9	In/Out	SSRX+	Super Speed Receiver(differential)
10	In/Out	SSRX-	Super Speed Receiver (differential)
Shell		Shield	Shield

"Electrical characteristics of signals"

Signal	Parameter	min	nom	max	Unit
VBUS_IN		4.45	5.00	5.25	V
IVBUS_IN				900	mA

USB Type C Connector (CON3)

• Standard USB3.2 Gen.1 TYPE-C, Connector Type: JAE_DX07S024JJ2

Figure 30: Pinning USB Type C

Pin	I/O	Signal	Description
A1	GND	GND	Ground for Super Speed Signals
A2	In/Out	SSTX1+	Super Speed Transmitter (differential)
A3	In/Out	SSTX1-	Super Speed Transmitter (differential)
A4	Power_IN	VBUS_IN	Digital Output
A5	IN	CC1	Configuration Channel
A6	In/Out	D+	USB 2.0 Data + (differential)
A7	In/Out	D-	USB 2.0 Data - (differential)
A8	–	NC	Sideband Use → Alternate Mode
A9	Power_IN	VBUS_IN	Digital Output
A10	In/Out	SSRX2-	Super Speed Receiver (differential)
A11	In/Out	SSRX2+	Super Speed Receiver (differential)
A12	GND	GND	Ground for Super Speed Signals
B1	GND	GND	Ground for Super Speed Signals
B2	In/Out	SSTX1+	Super Speed Transmitter (differential)
B3	In/Out	SSTX1-	Super Speed Transmitter (differential)
B4	Power_IN	VBUS_IN	Digital Output
B5	IN	CC1	Configuration Channel
B6	In/Out	D+	USB 2.0 Data + (differential)
B7	In/Out	D-	USB 2.0 Data - (differential)
B8	–	NC	Sideband Use > Alternate Mode
B9	Power_IN	VBUS_IN	Digital Output
B10	In/Out	SSRX1-	Super Speed Receiver (differential)
B11	In/Out	SSRX1+	Super Speed Receiver (differential)
B12	GND	GND	Ground for Super Speed Signals
Shell	Shield	GND	Shield

"Electrical characteristics of signals"

Signal	Parameter	min	nom	max	Unit
VBUS_IN		4.45	5.00	5.25	V
IVBUS_IN				900	mA

3-pin I2C connector (CON4)

• Part type:
  • Wire to Bord Connector 1.25 mm, WUERTH_653003114822 or MOLEX PicoBlade 53047_0310
• Mating part:
  • Würth: 653 003 113 322 1.25 MM female terminal housing with female crimp terminal WR-WTB 653 001 137 22 or
  • Molex 0510210300, 1.25 Wire to Board Connection Receptacle Housing, Applicable Terminal 50058-8000, 50079-8000 Series

Pin	I/O	Signal	Description
1	-	GND	Camera GND
2	Out	SCL	I2C Clock
3	Bi	SDA	I2C data

"Electrical characteristics of signals"

• Camera provides a I2C master to control devices connected to the bus
• Interface clock rate 400kHz
• Reserved I2C addresses (8Bit) of shared devices: 0x0, 0x30...0x36, 0x48, 0x60...0x66, 0xA0...0xA6, 0xB0...0xBE, 0xF8
• Access to the I2C interface has to be enabled
• By default the access to the I2C bus is disabled to prevent unintended interference

See also

API documentation: https://assets.balluff.com/documents/DRF_957355_AA_000/classmv_1_1impact_1_1acquire_1_1GenICam_1_1mvI2cInterfaceControl.html

Signal	Parameters / Properties	min	nom	max	Unit
I2C_SCL / I2C_SDA	Voltage level, internal 2K pull up to 3.3 V		3.3	3.4	V

Components

Features		BVS CA-SF1	BVS CA-SF2	BVS CA-SF3	BVS CA-SF4	BVS CA-SF5
Interface		USB 3.2 Gen 1 / USB 2.0 (up to 5 Gbit/s / up to 480 Mbit/s )
Image Memory		256 MBytes
Digital Inputs		2	2	4	2	4
	Type	opto-isolated with current limiters	opto-isolated with current limiters	CMOS/TTL with adjustable I/O level	opto-isolated with current limiters	CMOS/TTL with adjustable I/O level
Digital Outputs		4	4	4	4	4
	Type	opto-isolated	opto-isolated	CMOS/TTL with adjustable I/O level	opto-isolated	CMOS/TTL with adjustable I/O level
Lens Mount (Focal Distance)		C-mount (17.526 mm in air), CS-mount (12.526 mm in air)	C-mount (17.526 mm in air), CS-mount (12.526 mm in air)	C-mount (17.526 mm in air)	several options available	several options available
Environment	Ambient Temperature
	Operation	0..45 deg C / 30 to 80% RH 1
	Storage	-20..60 deg C / 20 to 90% RH
	Protection class 2	IP30	IP30	x	IP30	x
Weight without lens		approx. 58.5 g; board-level model without lensholder approx. 7 g	approx. 94 g & approx. 110 g acc. to lensholder, heat sink plate: 16 g; board-level model without lensholder approx. 21 g	approx. 9 g (base module)	approx. 175 g	approx. 17 g (camera board)
Power supply (PWR_IN)
	Consumption via Vbus	< 4.5 W			< 4.8 W	< 4.5 W
	Option 10 to 28 V	DC 10 to 28 V Pmax 5.5 W		DC 10 to 28 V Pmax 5.5 W

¹ for board level cameras follow cooling recommendations in "BVS CA-SF3 / BVS CA-SF5: Cooling instructions" and "BVS CA-SF2: Cooling instructions" which are part of the scope of delivery
² not evaluated by UL