Balluff - BVS CA-SF Technical Documentation
Technical Data

Table of Contents

Dimensions

Standard model (BVS CA-SF1)

Figure 1: BVS CA-SF1-xxxxxx-x6xx2x dimensions and connectors
BVS CA-SF1-xxxxxx-x6xx2x
Size of body (w x h x l) 39 x 39 x 24 mm
Lens protrusion C-Mount CS-Mount
12.5 mm 7.5 mm

Mounting holes

On the bottom-side, the BVS CA-SF1 provides integrated tripod mounting holes.

Figure 2: BVS CA-SF1 mounting holes
Figure 3: Dimensional drawing of tripod adapter

Standard model (BVS CA-SF2)

Option -11xxx (lensholder without back focus adjustment)

Figure 4: BVS CA-SF2-xxxxxx-11xxxx dimensions and connectors
BVS CA-SF2-xxxxxx-11xxxx
Size of body (w x h x l) 40 x 40 x 50.9 mm
Lens protrusion
10.7 mm with 1" lenses

Mounting holes

The BVS CA-SF2-xxxxxx-12xxxx provides integrated mounting holes.

Figure 5: BVS CA-SF2-xxxxxx-11xxxx mounting holes

Option -12xxx (lensholder with back focus adjustment)

Figure 6: BVS CA-SF2-xxxxxx-12xxxx dimensions and connectors
BVS CA-SF2-xxxxxx-12xxxx
Size of body (w x h x l) 39.8 x 39.8 x 37.7 mm
Lens protrusion C-Mount CS-Mount
X 8 mm 6 mm
C-Mount CS-Mount
W approx. 15 mm (C-mount) approx. 10 mm (CS-mount)
Z 17.526 mm (in air) 12.5 mm (in air)

Mounting holes

The BVS CA-SF2-xxxxxx-12xxxx provides integrated mounting holes.

Figure 7: BVS CA-SF2-xxxxxx-12xxxx mounting holes

Model without housing (BVS CA-SF1-xxxxxx-x00000)

Attention
"Broken connectors"

Handle the connectors with care otherwise you can damage the device.

→ In combination with the connectors, please limit the mechanical stress.
Figure 8: BVS CA-SF1-xxxxxx-x00000 dimensions and connectors
Figure 9: BVS CA-SF1-xxxxxx-xY0000 with S-Mount lensholder BF3-LH-SMNT 13

I/O board mvBlueFOX3-IO

Figure 10: Dimensions of additional I/O board mvBlueFOX3-IO

The following figure shows, how the additional I/O board mvBlueFOX3-IO gets connected correctly.

Attention
"Short circuit"

Since the connector of the I/O board will also fit upside down, you have to be careful while connecting. Otherwise you can destroy the camera and / or the I/O board.

→ As show in the figure, if the I/O board was connected correctly, you can bend the I/O board on the back of the sensor board. Then the I/O board connector will point to the opposite direction as the sensor.
Figure 11: BVS CA-SF1-xxxxxx-x00000 connected I/O board

The pinning of the mvBlueFOX3-IO is described in the chapter Circular connector male (Power / Digital I/O).

Note
There is also a version of the I/O board without connector as "mvBlueFOX3-IO NC" (NC = not connected). The pinning is provided in the figure:


Figure 12: Dimensions of additional I/O board mvBlueFOX3-IO without connector

Model without housing (BVS CA-SF2-xxxxxx-xxx0xx)

Attention
"Broken connectors"

Handle the connectors with care otherwise you can damage the device.

→ In combination with the connectors, please limit the mechanical stress.
Figure 13: BVS CA-SF2-xxxxxx-x0x02x dimensions and connectors

S-mount lensholder and heat sink backplate option (BVS CA-SF2-xxxxxx-xYx5xx)

The heat sink backplate is connected to the GND potential of the camera's power. The connection itself takes place via the fixing points. Both, the mounting holes on the lensholder (4x M2) as well as the mounting holes at the heat sink plate (2x M3) can be used to mount the camera.

Figure 14: BVS CA-SF2-xxxxxx-xYx5xx dimensions and connectors
Attention
"Overheating"

Wihtout a heat sink the device can be damaged.

→ Pay attention to the Overheating and Cooling .

C-mount lensholder and heat sink backplate option (BVS CA-SF2-xxxxxx-x1x51x)

The heat sink backplate is connected to the GND potential of the camera's power. The connection itself takes place via the fixing points. Both, the mounting holes on the lensholder (12x M4) as well as the mounting holes at the heat sink plate (2x M3) can be used to mount the camera.

Figure 15: BVS CA-SF2-xxxxxx-x1x51x dimensions and connectors
Attention
"Overheating"

Wihtout a heat sink the device can be damaged.

→ Pay attention to the Overheating and Cooling .
Lens protrusion
X 10.7 mm with 1" lenses
C-Mount CS-Mount
Z 17.526 mm (in air) 12.5 mm (in air)

Fixed and compact C-mount lensholder (BVS CA-SF2-xxxxxx-x7x01x)

Figure 16: BVS CA-SF2-xxxxxx-x7x01x dimensions and connectors
Lens protrusion
X 13.1 +- 0.5
C-Mount
Z 17.526 mm (in air)

Single-board Model for Embedded Vision (BVS CA-SF3)

Figure 17: BVS CA-SF3-xxxxxx-1xxx2x dimensions and connectors
See also
BFembedded interface (BVS CA-SF3,BVS CA-SF5)

Hi-res model (BVS CA-SF4)

Figure 18: BVS CA-SF4-xxxxxx-xNxx2x dimensions and connectors
BVS CA-SF4-xxxxxx-xNxx2x
Size of body (w x h x l) 49.8 x 49.8 x 54.215 mm

Mounting holes

The BVS CA-SF4 provides integrated mounting holes.

Figure 19: BVS CA-SF4 mounting holes

Board-level Model for Embedded Vision (BVS CA-SF5)

Figure 20: BVS CA-SF5-xxxxxx-1xxx2x dimensions and connectors
Note
The red dot marks pin 1.
See also
BFembedded interface (BVS CA-SF3,BVS CA-SF5)

Camera interfaces (BVS CA-SF)

Circular connector male (Power / Digital I/O)

Figure 21: 12-pin (male; top view), digital I/O, power
Pin. BVS CA-SF1 (Signal) BVS CA-SF2 / BVS CA-SF4 (Signal) Line in ImpactControlCenter Cable KS-BCX-HR12 color scheme
1 GND (for PWR_IN)   black
2 not connected, leave open PWR_IN   brown
3 Opto DigOut3 Line3 red
4 Opto DigIn0 Line4 orange
5 Opto DigOut2 Line2 yellow
6 Opto DigOut0 Line0 green
7 Opto DigIn_GND   blue
8 RS232 RX   violet
9 RS232 TX   gray
10 Opto DigOut_PWR_IN   white
11 Opto DigIn1 Line5 white-black
12 Opto DigOut1 Line1 white-brown
Main connector shield Main connector shield Main shield

Connector (camera side): SAMWOO SNH-10-12 (RPCB) or equivalent
Plug (matching cable plug): Hirose HR10A-10P-12S (01) or equivalent

Pinning of KS-BCX-HR12

Pin. CON 1 BVS CA-SF1 | Signal CON 1 BVS CA-SF2 / BVS CA-SF4 | Signal CON 2 open ended cable | Color
1 GND (for PWR_IN) black
2 not connected PWR_IN brown
3 DigOut3 (ImpactControlCenter numbering: line3) red
4 Opto DigIn0 (line4) orange
5 DigOut2 (line2) yellow
6 DigOut0 (line0) green
7 Opto DigIn GND blue
8 RS232_RX violet
9 RS232_TX gray
10 Opto DigOut_PWR_IN white
11 Opto DigIn1 (line5) white-black
12 Opto DigOut1 (line1) white-brown
Main connector shield main shield

Color assignment following international code for UL wiring.

Power Supply

The devcies are bus powered. Anyway, it is possible to power the BVS CA-SF2 externally with following specs:

  • Input voltage range:
    • 12 .. 24 V DC (typical)
    • min. 10V
    • max. 28V
  • The power supply is protected against
    • burst (EN 61000-4-4)
    • surge (EN 61000-4-5) and
    • polarity inversion
  • internal short circuit protection by 1.5 A slow blow fuse

The USB power cannot be accessed via the I/O connector (this is prevented by a diode).

Note
The BVS CA-SF2 will reboot whenever you connect or disconnect the power at pin 2.
Attention
For BVS CA-SF4 an external power supply is obligatory (USB power supply may exceed 900 mA).

Characteristics of the digital inputs

Electrical characteristics

Delay

Figure 22: Input switching times
  Standard
Notes  
High level +3 to +24 V (max. 30 V)
Low level 0 V (min. -30 V) to +0.7 V
Threshold
(Low --> High /
High --> Low) 		2 V +- 1 V
Imax 5 mA
 
Figure 23: Opto DigIn mvBlueFOX3-1/-2/-M2/-4

Switching characteristics

Characteristics Symbol Test conditions Typ. Unit
Minimum trigger pulse width 5 us
Turn-On time tON R = 2 kOhm (Figure 7), internal output voltage 5 V, IF = 16 mA 10
Storage time tS 25
Turn-Off time tOFF 40

Characteristics of the digital outputs

Electrical characteristics

  Comment Min. Typ. Max. Unit
IC load current     15 mA
VCE(sat) @ IC = 7 mA   0.4   V
VOUT Output Voltage     30 V
 
Figure 24: Opto DigOut BVS CA-SF1/BVS CA-SF2/BVS CA-SF4
       

Switching characteristics

Characteristics Symbol Test conditions Typ. Unit
Turn-On time tON RL = 100 Ohm, VCC 10 V, IC = 2 mA 3 us
Storage time tS 3
Turn-Off time tOFF 3
Turn-On time tON RL = 1.9 kOhm, VCC 5 V, IC = 16 mA 10 us
Storage time tS 25
Turn-Off time tOFF 40
Figure 25: Switching time

Status / Power LED

Standard model (BVS CA-SF1)

State LED color
No power, no USB connection or DeviceIndicatorMode is set to Inactive. Off
No Bootloader found, Bootloader was recognized and FPGA is booting-up or device is in standby mode. Red
mvBlueFOX3 is running. Green
mvBlueFOX3 is busy (e.g. file upload). Green blink

Standard model (BVS CA-SF2)

State LED color
No power or DeviceIndicatorMode is set to Inactive. Off
Bootloader was recognized and FPGA is booting-up. White
mvBlueFOX3 is running. Yellow
mvBlueFOX3 is streaming images. Green
mvBlueFOX3 is busy (e.g. file upload). Yellow blink
Waiting for USB connection with loaded FPGA (external power is connected). White blink
Waiting for first USB connection, internal Error detected or device is put into standby. Red
For HW Revision 2.01: Device is put into standby. Turquoise

BFembedded interface (BVS CA-SF3,BVS CA-SF5)

The BFembedded interface provides USB3.2 Gen.1 - SuperSpeed (5Gbps) including USB2.0 - Hi-Speed (480Mbps) and various IO functionality on a single 48-pin Board-to-Board connector. The main features of the user I/O interface are

  • 4 digital inputs,
  • 4 digital outputs,
  • a UART interface for serial communication, and
  • a I2C two wire serial interface.
Attention
"Disconnections"

When using BVS CA-SF3 or BVS CA-SF5 with the rigid-flex extension cable (BFE-FLEX), please ensure you have connected it correctly.

"Camera connector"

  • Hirose DF40GB-48DP-0.4V

"Mating Connector"

Used for accessory IO Boards or customer implementation.

  • Hirose DF40GB(3.0)-48DS-0.4V

"Mechanical characteristics"

  • 48-pin, 0.4 mm pitch, shielded, stacking height: 3.0 mm
  • 2 steel spacers (height 3mm). Thread M1.6, max. screw depth 1.8 mm.

Pin assignment

Figure 26: BFembedded interface - pin 1
Note
The red dot marks pin 1 of Hirose DF40GB-48DP-0.4V.
Pin Signal Description
1 VBUS_5V USB Power
2 VBUS_5V USB Power
3 VBUS_5V USB Power
4 POWER_DOWN_N - Complete power shut down
  • Pull to GND for power down
  • Internal 10K pull up to VBUS_5V
5 VBUS_5V USB Power
6 VAUX_PRESENT_N - External power supply indication
  • Connect to VBUS if USB supplied
  • Otherwise leave open
7 D- USB 2.0 Data - (differential)
8 - Do not connect, internal use
9 D+ USB 2.0 Data + (differential)
10 - Do not connect, internal use
11 ID OTG-Identification (OTG = On-The-Go)
12 - Do not connect, internal use
13 GND Ground
14 - Do not connect, internal use
15 GND Ground
16 GND Ground
17 GND Ground
18 GND Ground
19 SSTX- USB3 Super Speed Transmitter (differential), polarity inversion allowed
20 - Do not connect, internal use
21 SSTX+ USB3 Super Speed Transmitter (differential), polarity inversion allowed
22 - Do not connect, internal use
23 GND Ground
24 - Do not connect, internal use
25 SSRX+ USB3 Super Speed Receiver (differential), polarity inversion allowed
26 - Do not connect, internal use
27 SSRX- USB3 Super Speed Receiver (differential), polarity inversion allowed
28 - Do not connect, internal use
29 GND Ground
30 - Do not connect, internal use
31 GND Ground
32 GND Ground
33 GND Ground
34 GND Ground
35 DigOut0 Digital Output (with level shifter), voltage reference VCC_IO
36 VCC_IO I/O voltage reference input 1.8 V...5.0 V, abs. min max: 1.65 V...5.5 V
Note
Leave not unconnected! Connect to VBUS_5V if I/O not used.
37 DigOut1 Digital Output (with level shifter), voltage reference VCC_IO
38 DigIn2 Digital Input (with level shifter), voltage reference VCC_IO
39 DigOut2 Digital Output (with level shifter), voltage reference VCC_IO
40 DigIn3 Digital Input (with level shifter), voltage reference VCC_IO
41 DigOut3 Digital Output (with level shifter), voltage reference VCC_IO
42 UART_RX Serial interface (see details below), LVCMOS 3.3 V IO level
43 DigIn0 Digital Input (with level shifter), voltage reference VCC_IO
44 UART_TX Serial interface (see details below), LVCMOS 3.3 V IO level
45 DigIn1 Digital Input (with level shifter), voltage reference VCC_IO
46 I2C_SCL I2C two wire serial bus (see details below), LVCMOS 3.3 V IO level
47 - Do not connect, internal use
48 I2C_SDA I2C two wire serial bus (see details below), LVCMOS 3.3 V IO level
Note
Additional shield pins are connected to GND.

Electrical characteristics of signals

USB Power

Signal Parameter min nom max Unit
VBUS_5V   4.45 5 5.25 V
IVBUS_5V*       900 mA
I per pin       300 mA

*Limit for USB3 high-power SuperSpeed devices (Power consumption of the camera will be within this limit).

The rated current limit for the connector is 300 mA per pin and therefore the BF3-Embedded Interface would allow up to 1200 mA.

VCC_IO / DIGIN / DIGOUT

Signal Parameter min nom max Unit
VCC_IO I/O voltage power 1.65 5.5 V
UDIG_IN_LOW VIL (low level input voltage)     VCC_IO x 0.3 V
UDIG_IN_HIGH VIH (high level input voltage) VCC_IO x 0.7     V
IOH High-level output current VCC_IO: 4.5 V to 5.5 V     -32 mA
IOL Low-level output current VCC_IO: 4.5 V to 5.5 V     32 mA
UDIG_OUT_HIGH Digital output (VCC_IO = 4.5 V / IOUT= -32 mA) 3.8     V
UDIG_OUT_LOW Digital output (VCC_IO = 4.5 V / IOUT= 32 mA)     0.55 V

Digital I/Os include level shifters to allow customized IO Levels for both inputs and outputs. VCC_IO (Pin 36) is the input for the user defined IO voltage.

Note
If no I/O functionality is needed, connect VCC_IO to VBUS_5V.

For other output characteristics, see datasheet SN74LVC2T45.

Serial Interface, I2C and Power Down

Signal Parameters / Properties min nom max Unit
POWER_DOWN_N Complete power shut down, internal 10K pull up to VBUS_5V
POWER_DOWN_N Input Low Voltage 0 0.75 V
POWER_DOWN_N Input High Voltage 1.8 5 V
UART_RX / UART_TX Voltage level
  • The camera provides a UART Interface for serial communication (internally protected by 100 Ohm series resistor)
3.3 3.4 V
I2C_SCL / I2C_SDA Voltage level, internal 2K pull up to 3.3 V
  • Camera provides a I2C master to control devices connected to the bus
  • Interface clock rate 400 kHz
  • Reserved I2C addresses (8 Bit) of shared devices: 0x0, 0x30...0x36, 0x48, 0x60...0x66, 0xA0...0xA6, 0xB0...0xBE, 0xF8
  • Access to the I2C interface has to be enabled
  • By default the access to the I2C bus is disabled to prevent unintended interference
3.3 3.4 V

Boards for the BFembedded interface (BVS CA-SF3,BVS CA-SF5)

USB Micro B (horizontal)

The board includes a USB3 Micro B connector (CON3) in horizontal alignment, a 12-pin header (CON2) for IO signals and a 3-pin header (CON4) for I2C, weight 2g.

"Order Code": BFE-IF-MICUSB3B-H-IO12

Figure 27: Connectors of the USB3 Micro B board (horizontal)

USB Micro B (vertical)

The board includes a USB3 Micro B connector (CON3) in vertical alignment, a 12-pin header (CON2) for IO signals and a 3-pin header (CON4) for I2C, weight 2g.

"Order Code": BFE-IF-MICUSB3B-V-IO12

Figure 28: Connectors of the USB3 Micro B board (vertical)

USB Type C

The board includes a USB Type C connector (CON3) in horizontal alignment, a 12-pin header (CON2) for IO signals and a 3-pin header (CON4) for I2C, weight 2g.

"Order Code": BFE-IF-USB3C-H-IO12

Figure 29: Connectors of the USB Type C board

Pin assignments

12-pin I/O connector (CON2)

  • Part type:
    • Wire-to-Bord Connector 1.25 mm, WUERTH_653012114822 or MOLEX PicoBlade 53047_1210
  • Connecting part:
    • Würth: 653 012 113 322 1.25 MM female terminal housing with female crimp terminal WR-WTB 653 001 137 22 or
    • Molex 0510211200, 1.25 Wire to Board Connection Receptacle Housing, Applicable Terminal 50058-8000, 50079-8000 Series
Pin I/O Signal Description
1 Out DigOut0 Digital Output
2 Out DigOut1 Digital Output
3 Out DigOut2 Digital Output
4 Out DigOut3 Digital Output
5 In DigIn0 Digital Input
6 In DigIn1 Digital Input
7 In DigIn2 Digital Input
8 In DigIn3 Digital Input
9 Out RS232_TXD Serial Interface RS232_TXD
10 In RS232_RXD Serial Interface RS232_RXD
11 GND GND Ground
12 POWER_OUT VBUS_OUT Directly connected to USB Power

"Electrical characteristics of signals"

"VBUS_OUT / DIGIN / DIGOUT"

Signal Parameter min nom max Unit
VBUS_OUT   4.45 5.00 5.25 V
IVBUS_OUT       10 mA
UDIG_IN_LOW VIL (low level inputvoltage)     0.3 V
UDIG_IN_HIGH VIH (high level inputvoltage) 0.7   5.5 V
IOH High-level output current     -32 mA
IOL Low-level output current     32 mA
UDIG_OUT_HIGH Digital output (IOUT= -32 mA) 3.8     V
UDIG_OUT_LOW Digital output (IOUT= 32 mA)     0.45 V

"Serial interface RS232"

Signal Test Properties min nom max Unit
EIA/TIA-232E Input Voltage Range*   -30   +30 V
EIA/TIA-232E Input Threshold Low   0.6 1.3    V
EIA/TIA-232E Input Threshold High     1.6  2.4 V
EIA/TIA-232E Input Hysteresis      0.4   mA
EIA/TIA-232E Input Resistance   3  5 7 V
Output Voltage Swing   ±5.0 ±5.7   V
RS-232 Output Short-Circuit Current     ±15   mA
ESD PROTECTION Human body model air discharge
Human body model contact discharge 		  ±15
±8 		  kV
kV
TIMING CHARACTERISTICS
Maximum Data Rate 		  460     kbps

* Guaranteed by design.

USB Micro B Connector (CON3)

  • Standard USB3.0 Micro-B Connector
  • Part Type: WUERTH_ 692 622 030 100
Pin I/O Signal Description
1 Power_IN VBUS_IN Digital Output
2 In/Out D- USB 2.0 Data −(differential)
3 In/Out D+ USB 2.0 Data +(differential)
4 IN ID OTG-Identification (OTG= On-The-Go)
5 GND GND Ground to Pin 1
6 In/Out SSTX- Super Speed Transmitter(differential)
7 In/Out SSTX+ Super Speed Transmitter(differential)
8 GND GND Ground for Super SpeedSignale
9 In/Out SSRX+ Super Speed Receiver(differential)
10 In/Out SSRX- Super Speed Receiver (differential)
Shell   Shield Shield

"Electrical characteristics of signals"

Signal Parameter min nom max Unit
VBUS_IN   4.45 5.00 5.25 V
IVBUS_IN       900 mA

USB Type C Connector (CON3)

  • Standard USB3.2 Gen.1 TYPE-C, Connector Type: JAE_DX07S024JJ2
Figure 30: Pinning USB Type C
Pin I/O Signal Description
A1 GND GND Ground for Super Speed Signals
A2 In/Out SSTX1+ Super Speed Transmitter (differential)
A3 In/Out SSTX1- Super Speed Transmitter (differential)
A4 Power_IN VBUS_IN Digital Output
A5 IN CC1 Configuration Channel
A6 In/Out D+ USB 2.0 Data + (differential)
A7 In/Out D- USB 2.0 Data - (differential)
A8 – NC Sideband Use → Alternate Mode
A9 Power_IN VBUS_IN Digital Output
A10 In/Out SSRX2- Super Speed Receiver (differential)
A11 In/Out SSRX2+ Super Speed Receiver (differential)
A12 GND GND Ground for Super Speed Signals
B1 GND GND Ground for Super Speed Signals
B2 In/Out SSTX1+ Super Speed Transmitter (differential)
B3 In/Out SSTX1- Super Speed Transmitter (differential)
B4 Power_IN VBUS_IN Digital Output
B5 IN CC1 Configuration Channel
B6 In/Out D+ USB 2.0 Data + (differential)
B7 In/Out D- USB 2.0 Data - (differential)
B8 – NC Sideband Use > Alternate Mode
B9 Power_IN VBUS_IN Digital Output
B10 In/Out SSRX1- Super Speed Receiver (differential)
B11 In/Out SSRX1+ Super Speed Receiver (differential)
B12 GND GND Ground for Super Speed Signals
Shell Shield GND Shield

"Electrical characteristics of signals"

Signal Parameter min nom max Unit
VBUS_IN 4.45 5.00 5.25 V
IVBUS_IN 900 mA

3-pin I2C connector (CON4)

  • Part type:
    • Wire to Bord Connector 1.25 mm, WUERTH_653003114822 or MOLEX PicoBlade 53047_0310
  • Mating part:
    • Würth: 653 003 113 322 1.25 MM female terminal housing with female crimp terminal WR-WTB 653 001 137 22 or
    • Molex 0510210300, 1.25 Wire to Board Connection Receptacle Housing, Applicable Terminal 50058-8000, 50079-8000 Series
Pin I/O Signal Description
1 - GND Camera GND
2 Out SCL I2C Clock
3 Bi SDA I2C data

"Electrical characteristics of signals"

  • Camera provides a I2C master to control devices connected to the bus
  • Interface clock rate 400kHz
  • Reserved I2C addresses (8Bit) of shared devices: 0x0, 0x30...0x36, 0x48, 0x60...0x66, 0xA0...0xA6, 0xB0...0xBE, 0xF8
  • Access to the I2C interface has to be enabled
  • By default the access to the I2C bus is disabled to prevent unintended interference
See also
API documentation: https://assets.balluff.com/documents/DRF_957355_AA_000/classmv_1_1impact_1_1acquire_1_1GenICam_1_1mvI2cInterfaceControl.html
Signal Parameters / Properties min nom max Unit
I2C_SCL / I2C_SDA Voltage level, internal 2K pull up to 3.3 V 3.3 3.4 V

Components

Features   BVS CA-SF1 BVS CA-SF2 BVS CA-SF3 BVS CA-SF4 BVS CA-SF5
Interface   USB 3.2 Gen 1 / USB 2.0 (up to 5 Gbit/s / up to 480 Mbit/s )
Image Memory   256 MBytes
Digital Inputs   2 2 4 2 4
  Type opto-isolated with current limiters opto-isolated with current limiters CMOS/TTL with adjustable I/O level opto-isolated with current limiters CMOS/TTL with adjustable I/O level
Digital Outputs   4 4 4 4 4
  Type opto-isolated opto-isolated CMOS/TTL with adjustable I/O level opto-isolated CMOS/TTL with adjustable I/O level
Lens Mount (Focal Distance)   C-mount (17.526 mm in air), CS-mount (12.526 mm in air) C-mount (17.526 mm in air), CS-mount (12.526 mm in air) C-mount (17.526 mm in air) several options available several options available
Environment Ambient Temperature  
  Operation 0..45 deg C / 30 to 80% RH 1
  Storage -20..60 deg C / 20 to 90% RH
  Protection class 2 IP30 IP30 - IP30 -
Weight without lens   approx. 58.5 g; board-level model without lensholder approx. 7 g approx. 94 g & approx. 110 g acc. to lensholder, heat sink plate: 16 g; board-level model without lensholder approx. 21 g approx. 9 g (base module) approx. 175 g approx. 17 g (camera board)
Power supply (PWR_IN)    
  Consumption via Vbus < 4.5 W < 4.8 W < 4.5 W
  Option 10 to 28 V DC 10 to 28 V
Pmax 5.5 W 		  DC 10 to 28 V
Pmax 5.5 W 		 

1 for board level cameras follow cooling recommendations in "BVS CA-SF3 / BVS CA-SF5: Cooling instructions" and "BVS CA-SF2: Cooling instructions" which are part of the scope of delivery
2 not evaluated by UL