Balluff - BVS CA-MLC / BVS CA-IGC Technical Documentation
Technical Data

Power supply

SymbolCommentMinTypMaxUnit
UUSBPOWER_INPower supply via USB4.7555.25V
IUSBPOWER_IN (@ 5V / 40MHz)  280500mA
IUSBPOWER_IN (Power Off Mode)  66 mA

Single-board version (BVS CA-MLC)

Typical Power consumption @ 5V

ModelPower consumption (+/- 10%)Unit
-200w1.09W
-202a1.39W
-202b1.58W
-202d1.28W
-202v1.35W
-2051.37W

Dimensions and connectors

Figure 1: BVS CA-MLC-xxxxxx-1600OX-001
Note
The BVS CA-MLC has a serial I²C bus EEPROM with 16 KByte of which 8 KByte are reserved for the firmware and 8 KByte can be used to store custom arbitrary data.
See also
UserDataEntry class description

Sensor's optical midpoint and orientation

The sensor's optical midpoint is in the center of the board (Figure 2: intersection point of the holes diagonals). The (0,0) coordinate of the sensor is located at the one bottom left corner of the sensor (please notice that Mini-B USB connector is located at the bottom at the back).

Note
Using a lens, the (0,0) coordinate will be mirrored and will be shown at the top left corner of the screen as usual!
Figure 2: Sensor's optical midpoint and orientation

Mini-B USB (USB 2.0)

Figure 3: Mini-B USB
PinSignalComment
1USBPOWER_INSupply voltage
2USB_DATA-Data
3USB_DATA+Data
4IDNot connected
5GNDGround

12-pin Wire-to-Board header (USB 2.0 / Dig I/O)

Note
If you have the BVS CA-MLC variant which uses the standard Mini-B USB connector, pin 2 and 3 (USB_DATA+ / USB_DATA-) of the header won't be connected!
pinOpto-isolated variantTTL compliant variantCable KS-MLC-USB2-IO-WCable KS-MLC-IO-W
 SignalCommentSignalComment  
1GNDGroundGNDGroundGND 
2USB_DATA+DataUSB_DATA+DataUSB_DATA+ 
3USB_DATA-DataUSB_DATA-DataUSB_DATA- 
4USBPOWER_INSupply voltageUSBPOWER_INSupply voltageUSBPOWER_IN 
5I2C SDASerial data line (the I2C interface is master-only, which means that I2C slaves can only be connected externally)I2C SDASerial data line  
6I2C SCLSerial clock line (the I2C interface is master-only, which means that I2C slaves can only be connected externally)I2C SCLSerial clock line  
7USBPOWER_INSupply voltageUSBPOWER_INSupply voltagered 
8GNDGroundGNDGroundblackblack
9OUT0-Opto-isolated digital output 0 (Negative voltage)OUT1TTL compliant digital output 1blueblue
10OUT0+Opto-isolated digital output 0 (Positive voltage)OUT0TTL compliant digital output 0violetviolet
11IN0-Opto-isolated digital input 0 (Negative voltage)IN1TTL compliant digital input 1graygray
12IN0+Opto-isolated digital input 0 (Positive voltage)IN0TTL compliant digital input 0pinkpink
Note
I2C bus uses 3.3 Volts. Signals have a 2kOhm pull-up resistor. Access to the I2C bus from an application is possible for BVS CA-MLC devices using Impact Acquire with version 1.12.44 or newer.

Manufacturer (suitable board-to-wire connector): Molex
Part number: 0510211200 1.25mm Housing
Link: https://www.molex.com/en-us/products/part-detail/510211200
Manufacturer (multi-pin connector for board-to-board connection): e.g. Garry
Link: http://www.mpe-connector.de/index.php?lang=de&menu=16&mating=1841&id_product=6591 (recommended variant: 659-1-012-O-F-RS0-xxxx; xxxx = length of the pins)

See also
Suitable assembled cable accessories for BVS CA-MLC: What's inside and accessories
High-Speed USB design guidelines
More information about the usage of retrofittable ferrite

Electrical characteristic

Digital inputs TTL

Figure 4: TTL digital inputs block diagram
Note
If the digital input is not connected, the state of the input will be "1" (as you can see in ImpactControlCenter).
TTL compliant variant
 CommentMinTypMaxUnit
IINILOW (INx)  -0.5mA
UINVIH3.6 5.5V
VIL-0.3 1.3V
LVTTL compliant variant
 CommentMinTypMaxUnit
IINILOW (INx)  -0.5mA
UINVIH2 3.8V
VIL-0.3 0.8V

TTL input low level / high level time: Typ. < 210ns

Digital outputs TTL

Figure 5: TTL digital outputs block diagram
 CommentMinTypMaxUnit
IOUTDig_out power  +-32mA
UOUTVOH (IOUT=32mA)3.8  V
VOH  5.25 
VOL (IOUT=32mA)  0.55V
VOL0.1   

TTL output low level / high level time: Typ. < 40ns

Opto-isolated digital inputs

Figure 6: Opto-isolated digital inputs block diagram with example circuit

Delay

CharacteristicsSymbolTyp.Unit
Turn-On timetON3us

The inputs can be connected directly to +3.3 V and 5 V systems. If a higher voltage is used, an external resistor must be placed in series (Figure 6).

Used input voltageExternal series resistor
3.3V .. 5Vnone
12V680 Ohm
24V2 KOhm
 CommentMinTypMaxUnit
UINVIH3 5.5V
VIL-5.5 0.8V

Opto-isolated digital outputs

Figure 7: Opto-isolated digital outputs block diagram with example circuit

Delay

Figure 8: Output switching times
CharacteristicsSymbolTest conditionsTyp.Unit
Turn-On timetONRL = 1.9 kOhm, VCC 5V, IC = 16mA 2us
Storage timetS25
Turn-Off timetOFF40
 CommentMinTypMaxUnit
Ionload current  15mA
Ioffleakage current  10uA
Von Sat. at 2.4 mAVIH0(0.2)0.4V
Voff   30V

LED states

State LED
Camera is not connected or defect LED off
Camera is connected but not initialized or in "Power off" mode. Orange light on
Camera is connected and activeGreen light on

Assembly variants

The BVS CA-MLC is available with following differences:

  • Mini-B USB connector and digital I/O pin header
    • 1/1 opto-isolated or 2/2 TTL compliant digital I/O
  • USB via header without Mini-B USB connector
  • female board connector instead of pin header (board-to-board connection)
  • 3 different S-mount depths
  • C(S)-mount compatibility using mvBlueCOUGAR-X flange
  • ambient temperature operation: 5..55 deg C / 30..80 RH
  • ambient temperature storage: -25..60 deg C / 20..90 RH

Single-board version with housing (BVS CA-IGC)

Dimensions and connectors

Figure 9: BVS CA-IGC-xxxxxx-16xxxx-001 with CS-mount without adjustable backfocus (standard)
Lens protrusionC-MountCS-Mount
X10 mm 5 mm
Figure 10: BVS CA-IGC-xxxxxx-19xxxx-001 with C-mount and adjustable backfocus
Lens protrusionC-Mount
X8 mm (9.5 mm with max. Ø 20 mm)
Note
The BVS CA-IGC has a serial I²C bus EEPROM with 16 KByte of which 8 KByte are reserved for the firmware and 8 KByte can be used to store custom arbitrary data.
See also
UserDataEntry class description

Mini-B USB (USB 2.0)

Figure 11: Mini-B USB
PinSignalComment
1USBPOWER_INSupply voltage
2USB_DATA-Data
3USB_DATA+Data
4IDNot connected
5GNDGround

4-pin circular plug-in connector with lock (I/O)

Figure 12: 4-pin circular plug-in connector (female)
PinSignalCommentColor (of cable)
1 IN0 +Opto-isolated digital input 0 (Positive voltage)brown
2 IN0 -Opto-isolated digital input 0 (Negative voltage)white
3 OUT0 +Opto-isolated digital output 0 (Positive voltage)blue
4 OUT0 -Opto-isolated digital output 0 (Negative voltage)black

Manufacturer: Binder
Part number: 79-3107-52-04

Electrical characteristic

Please have a look at the BVS CA-MLC digital I/O characteristics (opto-isolated model) of the 12-pin Wire-to-Board Header (USB / Dig I/O).

LED states

State LED
Camera is not connected or defect LED off
Camera is connected but not initialized or in "Power off" mode. Orange light on
Camera is connected and activeGreen light on

Positioning tolerances of sensor chip

The sensor's optical midpoint is in the center of the housing. However, several positioning tolerances in relation to the housing are possible because of:

  • Tolerance of mounting holes of the printed circuit board in relation to the edge of the lens holder housing is not specified but produced according to general tolerance DIN ISO 2768 T1 fine.
  • Tolerance of mounting holes on the printed circuit board because of the excess of the holes ± 0.1 mm (Figure 13; 2).
  • Tolerance between conductive pattern and mounting holes on the printed circuit board.
    Because there is no defined tolerance between conductive pattern and mounting holes, the general defined tolerance of ± 0.1 mm is valid (Figure 13; 1 in the Y-direction ± 0.1 mm; 3 in the Z-direction ± 0.1 mm)

There are further sensor specific tolerances, e.g. for model BVS CA-MLC-0004ZG:

  • Tolerance between sensor chip MT9V034 (die) and its package (connection pad)
    • Chip position in relation to the mechanical center of the package: 0.2 mm (± 0.1mm) in the X- and Y-direction (dimensions in the sensor data sheet according to ISO 1101)
  • Tolerance between copper width of the sensor package and the pad width of the printed circuit board
    During the soldering the sensor can swim to the edge of the pad: width of the pad 0.4 mm (possible tolerance is not considered), width of pin at least 0.35 mm, max. offset: ± 0,025mm

Further specific tolerances of other models on request.

Figure 13: Positioning tolerances of sensor chip
Note
There are also tolerances in lens which could lead to optical offsets.

Summary of components

Features -MLC-IGC
"-xOx-""-xTx-""-xLx-"-xxx2
Image Memory 8 Mpixels
ADC resolution CMOS: 10 bits (10/8 bit transfer)
Inputs 1 2 3 1
Type opto-isolatedTTLLVTTLopto-isolated
Outputs 1 2 x2
Type opto-isolated TTL xopto-isolated
USB 2.0 Mini-B USB (-xxW-) / 12-pin Wire-to-Board header (-xxB-) / Mini-B USB (-xxA-)Mini-B USB
Optics
Lens Mount (Focal Distance)C-mount (17.526 mm in air), CS-mount (12.5 mm in air), optional S-mountC-mount (17.526 mm in air), CS-mount (12.5 mm in air)
Environment
Ambient Temperature
Operation 0..45 deg C / 30 to 80% RH
Storage -20..60 deg C / 20 to 90% RH
  Protection class 1 IP40
Weight without lensapprox. 10 gapprox. 80 g
Power supply (PWR_IN)
DC 4.75 to 5.25 V via USB
Pmax 1.5 W
Peak current draw 0.5 A

1 not evaluated by UL

Summary of available digital I/O's